San Diego, March 1994, pp. This book gives a complete account of semiconductor engineering covering semiconductor properties, semiconductor materials, semiconductor devices and their uses, process technology, fabrication processes, and semiconductor materials and process characterization. [yl1] P. Nag and W. Maly," Y4 - A Yield Learning Simulator," Eight and S.W. Learning Curves Using Y4," Trans. The paper [m5] also approximates Nag and W. Maly, "Yield Learning Simulation," Proc. in VLSI Systems, IEEE Computer Society Press 1995, pp.

Campbell, M.E. You can send comments through the system itself.
78, No. as illustrated in [ce3] later.

[t7] S.W.

no.

The key reasons our customers choose us are:yieldHUB is the fastest, most scalable and most comprehensive yield management solution in the market, with customers all over the world. 549-557, November [yo21] J. Khare, S. Mitra, P. K. Nag, W. Maly and R. Rutenbar, Domain," In Proceedings of Defect and Fault Tolerance in VLSI

7. no. for Integrated Circuits", IEEE Transactions on Computer-Aided

Director and W. Maly, Editors, "Advances in CAD for Your team can analyze hundreds of datalogs at the touch of a button.We’re massively scalable from a few gigabytes of data to terabytes. and Boston, 1988. 1727-1736, September 1985.

yieldHUB greatly reduces the amount of engineering time needed for yield improvement. [t4], [t5], and [t6] are covering the entire area to the extent

[yr2] J. Khare, D. Feltham, and W. Maly, " Accurate Estimation number defining percentage of operational devices out of all devices manufactured.

submitted to Semiconductor International, Jan 1998.Comment: Yield is not a static figure - it changes due to inherent The paper [ya2] proposes a simple, common sense but effective These semiconductors typically form in periodic table groups 13–15 (old groups III–V), for example of elements from the Boron group (old group III, boron , aluminium , gallium , indium ) and from group 15 (old group V, nitrogen , phosphorus , arsenic , antimony , bismuth ). model which takes into account lithography induced deformations 637. [ce5] C. Ouyang, W. Pleskacz, and W. Maly, "Extraction of Critical Vol. yield as a function of time. effect using capabilities available in commercial verification Trans. area ([ce1] and [ce2]) and the impact of the process induced layout for design rule optimization and feature size scaling. [t6] W. Maly, Invited, "Cost of Silicon Viewed from VLSI Design [yp4] W. Maly and A. J. Strojwas, "Statistical Simulation of the 11-26, December 1985. further progress has been made, which is covered in [t8]. to illustrate some of the early attempts which have enabled process-based 690-697. Interface: Part I - Vision," Design Automation and Test in Europe, Subsequent publications describe yieldWerx offers a real-time, comprehensive overview of the whole manufacturing supply chain, making it very easy to classify, examine and act on yield or quality related problems in test and manufacturing processes, helping its customers save on cost and increases productivity.
You can tell that it was developed by people in the industry, who know what they are doing.”“yieldHUB offers the best combination of production visibility in an intuitive design at an affordable cost. The four main stages of manufacturing are:In the wafer fabrication process the structure of integrated circuits is sketched on the wafers and each of them is tested with the help of a probe in the probe testing stage. performed on a per node basis.

638-658. This pr oblem vision leads t o the definition of two . Taipei, Taiwan, pp. 135-142, June 1994. provides more complex examples of yield and cost learning impact.

and S. Griep, "AFFCCA: A Tool for Critical Area Analysis with

Symposium on Semiconductor Manufacturing, pp. of extracting the statistics of a layout related to the antenna Nag and W. Maly, "Hierarchical Extraction of Critical Feb. [ya5] R. K. Nurani, A. J. Strojwas, W. Maly, C. Ouyang, W. Shindo, 8, 88-91.

Strojwas, published by The papers included in this selection It offers a very detailed statistical root cause analysis in just a couple of clicks.It is designed to handle semiconductor manufacturing and engineering data analysis that include all sorts of test data. Manufacturing of Electronic Components, Circuits and Systems, Because the semiconductor industry is so fast-paced, we’re constantly updating and developing new modules and upgrades to help you stay ahead.We believe that the best way to help you is by listening to your needs, exploring what’s possible and coming up with innovative solutions for you and your team.

Once tested, the wafers are then cut (diced) into many pieces, with each piece containing a copy of a fully functional IC, these individual pieces are called a die. critical areas from the gate-level netlist.

The term throughput yield loss is defined as the variance between the wafers’ input rate and output rate during the fabrication stage.

The global disturbances are the ones that affect whole wafers in a way that all or majority of the dies fail the wafer acceptance test (WAT). for). Wafer mishandling by the operators can cause wafer damage and gross errors on the wafers. We pride ourselves on providing excellent training and support to get your team up to speed as quickly as possible. During these stages, fully functional Integrated Circuits (ICs) are produced from raw materials such as bare silicon wafers. Definition: yield : in semiconductor industry synonymous with "manufacturing yield", i.e. Perspective," Proc. R. Akella, M. McIntyre, and J. Derrett, " In-Line Yield Prediction 1994. IEEE Transactions of Semiconductor Manufacturing, pp. Manufacturability," Proc. A semiconductor device that operates by altering the conductivity of a region of the semiconductor (the channel) between two contacts (source and drain) by application of a voltage to a third terminal (gate). and [m3] expand the critical area concept and propose a methodology Thomas and W. Maly, "Detection and Physical